摘要
研究了时效时间对Sn-58Bi/Cu和Sn-58Bi-0.5Ce/Cu焊点组织和显微硬度的影响。结果表明:随着时效时间增加,Sn-58Bi/Cu和Sn-58Bi-0.5Ce/Cu焊点组织逐渐粗化,界面IMC厚度不断增加;同一时效时间下,Sn-58Bi-0.5Ce/Cu焊点的晶粒尺寸和界面IMC层厚度均低于Sn-58Bi/Cu焊点。焊点的显微硬度均随时效时间增加先增大后降低,且Sn-58Bi-0.5Ce/Cu焊点的显微硬度均高于Sn-58Bi/Cu焊点。Ce颗粒的添加可有效抑制时效过程中焊点组织的粗化及界面IMC层厚度的增加,从而获得较高的显微硬度。
The effects of aging time on the microstructure and microhardness of Sn-58Bi/Cu and Sn-58Bi-0.5Ce/Cu solder joints were studied. The results show that with the increase of aging time, the microstructure of Sn-58Bi/Cu and Sn-58Bi-0.5Ce/Cu solder joints coarsens, and the IMC layer thickness increases. Under the same aging time, the grain size and IMC layer thickness of Sn-58Bi-0.5Ce/Cu solder joint are lower than those of Sn-58Bi/Cu solder joint. With the increase of aging time, the microhardness of solder joints increases firstly and then decreases, and the microhardness of Sn-58Bi-0.5Ce/Cu solder joint is higher than that of Sn-58Bi/Cu solder joint. The addition of Ce particles can effectively inhibit the microstrucW.re coarsening of solder joint and the increase of IMC layer thickness during aging process, and higher microhardness is obtained.
出处
《热加工工艺》
CSCD
北大核心
2017年第11期44-46,50,共4页
Hot Working Technology
关键词
时效时间
显微组织
金属间化合物层
显微硬度
aging time
microstructure
intermetallic compound layer
microhardness
