基板厚度对电弧熔积成形应力场及基板翘曲变形的影响

Influence of Substrate Thickness on Stress Field and Warping Deformation of Substrate in Arc Deposition Forming

使用ANSYS有限元软件模拟研究了不同厚度基板下电弧熔积成形过程中的温度场、应力分布和基板的残余翘曲变形。计算结果表明:随着基板厚度的增加,成形件第一主应力的大应力区域面积逐渐缩小,成形件纵向残余应力最大值略有波动但相对稳定,基板翘曲变形减小,基板厚度对成形件变形和精度的影响也越来越小。模拟结果与试验测量结果具有良好的一致性,研究结论对电弧熔积增材成形工艺合理选择基板厚度具有理论和实际的指导意义。

The temperature field, stress distribution and residual warping deformation of substrate with different thicknesses during the process of arc deposition were investigated by using ANSYS.finite element software. The simulation results show that with the increase of substrate thickness, the high first principal stress area of component gradually reduces, and the maximum longitudinal residual stress of component remains relatively stable, the maximum of substrate warping deformation decreases, and the influence of substrate thickness on the deformation and precision of component decreases gradually. The simulation results are in good agreement with the experimental results. The analysis conclusion has theoretical and practical significance for the reasonable selection of the substrate thickness in arc deposition forming.