取种盘吸种微孔的高速数控加工及优化

High Speed Numerical Control Processing and Optimization of the Micro Hole of the Seed Disk

为满足用气吸式排种器的取种盘播种小粒径种子的要求,根据其结构特点采用高速数控加工,就加工难点提出解决方案并编写了数控加工程序,对取种盘加工超差进行分析后得出吸种微孔加工超差率与吸种微孔数的数学回归模型。通过在JPS-12型试验台上进行吸种试验,得出吸种微孔加工超差率与种子破损率和合格率的数学关系,进而得出孔数为72的取种盘,因其种子破损率较低,合格率较高,可以满足小粒种子的精量播种要求的结论。

In order to meet the requirements of small size seed sowing for seeding disc of the air suction metering device, according to its structural characteristics, high speed CNC machining was adopted, solutions were proposed aiming at machining difficulties and the NC program was prepared. After the analysis of the machining error, a mathematical regression model of the suction hole machining overproof rate and number of absorbing seed holes was gotten. The suction test was carried on JPS-12 type test, and the mathematical model between the suction hole machining overproof rate and seed damage rate and the qualified rate was gotten. Then the conclusion is that the seeding disc with 72 holes can meet the requirements of precision planting of small seed, because the seed damage rate is lower, the qualified rate is higher.