摘要
文章概评了玻璃基板的优势和制造技术。玻璃基板具有最好的尺寸稳定性、良好的导热率和光的各向同性,在LED照明和IC封装基板等领域有广阔应用与发展前景。
This paper described the advantages and manufacturing process of glass substrate. Glass substrate has the best dimensional stability, good thermal conductivity and Isotropic light perfonnance with broad application in LED lighting and IC substrate.
出处
《印制电路信息》
2017年第6期38-41,55,共5页
Printed Circuit Information
关键词
玻璃基板
封装玻璃基板
热膨胀系数
导热率
光的各向同性
Glass Substrate
Glass IC Substrate
Thermal Expansion Index
Thermal Conductivity
Isotropic Light
