摘要
文章通过酚醛环氧树脂、多官能环氧树脂、增韧剂、高导热填料的复配,研制出了一种高Tg高导热的金属基覆铜板。测试结果表明,该金属基覆铜板具有Tg高、导热性好、机械加工性能好、耐热性好、绝缘性高等优异的综合性能。
This paper developed a high Tg ＆ high thermal conductivity metal base copper clad laminate by complex formulation of novolac epoxy resin, multi-functional epoxy resin, toughening agent and high thermal conductivity fillers. The test results showed that this metal base copper clad laminate has excellent properties with high Tg, high thermal conductivity, good heat resistance, good machinability and high insulating.
出处
《印制电路信息》
2017年第6期47-49,共3页
Printed Circuit Information
关键词
高Tg
高导热
金属基覆铜板
High Tg
High thermal conductivity
Metal base copper clad laminate
