激光的强化因子和入射距离对铜薄膜能量衰减影响分析

Energy attenuation analysis of copper film with the enhancer and incident distance of laser

微机械电子系统中的铜薄膜分布很广,为了改进微机械电子系统的构件性能、延长使用寿命,提出一种激光冲击铜薄膜的能量衰减数学模型分析新方法。所提方法通过改进Kanai模型给出激光冲击铜薄膜的能量衰减数学模型,使用两步回归处理方法确定模型回归系数,保证模型回归精度。在模型的基础上,以激光入射周期为横坐标、多种类构件面积归一化结果为纵坐标,绘制铜薄膜吸收能量衰减和铜薄膜滞回能量衰减影响曲线图,根据曲线分析出构件面积、激光强化因子和激光入射距离对铜薄膜能量衰减的影响规律。实验结果说明,所提新方法的模型回归精度高,分析结果更加可靠。

The copper thin film is distributed in micro mechanic electrical system, in order to improve its compo- nents performance and life, a new mathematical model analysis method of energy attenuation based on laser impact is proposed. This model above is modified from the Kanai mode/. It uses two stage regression method to confirm the coef- ficient to ensure the accuracy. On the basis of model, drawing the energy attenuation influence curve of its absorption and hysteresis in which set the incident circle as abscissa and the normalization results of variety components areas as ordinate. Analyzing the influencing regulations of the components areas, laser enhancer and incident distance accord- ing to the curve. The experimental results show that this new method has high accuracy and is more reliable.