电子封装用免清洗助焊剂的研究进展

Research Progress of No-Clean Flux in Electronic Packaging

介绍了助焊剂的作用及其分类;总结了免清洗助焊剂的特点、种类和检测方法,介绍了几种新型免清洗助焊剂及其研究进展;对免清洗助焊剂的成分如活化剂、溶剂、表面活性剂和添加剂的功效做了说明,指出了存在的一些问题,并展望了今后的发展方向。

This paper describes the role and the classification of flux briefly ; mainly introduces the charac- teristics, types and test methods of no-clean flux, presents several new types of no-clean flux and the gen- eral research progress;illustrates the effect of compositions of no-clean flux, such as activators, solvents, surfactants and other additives. In the end, this paper points out some existing problems and looks ahead the prospect of the development in future.