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N_2流量对等离子体增强磁控溅射TiN涂层的影响 被引量:8

Effect of N_2 Flow Rate on TiN Coatings Deposited by Plasma Enhanced Magnetron Sputtering
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摘要 目的研究N_2流量对等离子体增强磁控溅射TiN涂层组织结构和性能的影响,优化TiN涂层的制备工艺。方法在不同N_2流量的条件下,采用等离子体增强磁控溅射法制备TiN涂层。采用3D形貌仪和扫描电子显微镜观察涂层的表面形貌,利用X射线衍射仪测定涂层的相结构,利用显微硬度计测试涂层试样的硬度,利用球-盘摩擦磨损试验机考察涂层试样的摩擦磨损性能,利用能谱仪分析磨痕表面的化学组成。结果 N_2流量小于61.5 mL/min时,增加N_2流量对总气压和靶电压的影响很小;N_2流量超过61.5 mL/min后,总气压和靶电压均随着N_2流量的增加而显著增大。随着N_2流量的增大,制备的TiN涂层X射线衍射谱中的TiN(111)、TiN(220)衍射峰强度不断增大,TiN(200)衍射峰强度先不变后突然减小。N_2流量约为61.5 mL/min时,制备的TiN涂层试样的致密性最好,硬度最高。N_2流量在50~61.5 mL/min范围内,制备的TiN涂层试样的磨损率较低,最低可达7.4×10^(-16) m^3/(N·m)。当N_2流量超过63 mL/min后,TiN涂层试样的磨损率显著增大。结论 N_2流量对等离子体增强磁控溅射TiN涂层择优取向、硬度及摩擦磨损性能的影响较显著,N_2流量约为61.5 mL/min时,制备的TiN涂层试样的硬度和耐磨性最好。 The work aims to optimize preparation technology of TiN coatings by studying effect of N2 flow rate on the mi- crostructure and properties of TiN coatings deposited by plasma enhanced magnetron sputtering. TiN coatings were prepared by plasma enhanced magnetron sputtering at different N2 flow rates. Surface morphology of the coatings was observed with 3D profilometer and scanning electron microscope, phase composition with X-ray diffractometer, hardness with a microhardness tester, friction and wear propertieswith ball-on-disk friction and wear tester, and chemical composition of griding cracks with energy disperse spectroscope. When N2 flow rate was less than 61.5 mL/min, total gas pressure and target voltage were slightly affected as N2 flow rate increased; but when N2 flow rate was over 61.5 mL/min, the total gas pressure and target voltage in- creased dramatically as N2 flow rate increased. With the increase of N2 flow rate, intensity of TIN(111) and TIN(220) diffraction peaks increased gradually while that of TIN(200) kept constant firstly and then declined sharply. The TiN-coated samples of the best compactness and highest hardness were obtained at the N2 flow rate of about 61.5 mL/min. The TiN-coated samples of wear rate as low as 7.4×10^-16 m^3/(N· m) were obtained at the N2 flow rate of 50 mL/min to 61.5 mL/min. However, wear rate of the TiN-coated samples increased significantly at the N2 flow rate of over 63 mL/min. Preferred orientation, hardness and fric- tion and wear properties of the TiN coatings deposited by plasma enhanced magnetron sputtering are obviously affected by N2 flow rate, and the best hardness and abrasion resistance can be obtained at the N2 flow rate of about 61.5 mL/min.
出处 《表面技术》 EI CAS CSCD 北大核心 2017年第6期161-167,共7页 Surface Technology
基金 国家自然科学基金(51275494 U1537108) 中央高校基本科研业务费专项资金(2652015084)~~
关键词 等离子体增强磁控溅射 TIN涂层 N2流量 迟滞回线 微观结构 摩擦磨损性能 plasma-enhanced magnetron sputtering TiN coating N2 flow rate hysteresis loop microstructure friction and wear properties
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  • 1陈俊杰,刘利国.硬质合金刀具表面磁控溅射TiN涂层的摩擦磨损性能研究[J].润滑与密封,2008,33(8):41-43. 被引量:2
  • 2郭皓元,孔德军.高温下TiN涂层的摩擦与磨损行为[J].材料热处理学报,2015,36(2):191-196. 被引量:5
  • 3陈利,汪秀全,尹飞,李佳.TiN涂层的微观组织结构及力学性能分析[J].硬质合金,2006,23(1):8-10. 被引量:15
  • 4Berry R W. Method of making a capacitor employing film-forming metal electrode[P].US: 2993266, 1961.
  • 5Davidse P D, Maissel L I. Dielectric thin films through rf sputtering[J]. J Appl Phys,1966, 37: 574-579.
  • 6Musil J, Baroch P, VIC ek J, Nam K H, Han J G. Reactive magnetron sputtering of thin films: present status and trends[J]. Thin Solid Films, 2005, 475: 205-218.
  • 7Manly S, Miner C J, Westwood W D. High rate deposition of transparent conducting films by modified reactive planar magnetron sputtering of Cd2Sn alloy [J], J Vac Sci Technol, 1981, 18(2): 195-198.
  • 8Okamoto A, Serikawa T. Reactive sputtering characteristics of silicon in an Ar-N2 mixture [J]. Thin Solid Films, 1986, 137: 143-151.
  • 9Schiller S, Heisig U, Steinfelder K, Strumpfel J. Cr-Si Resistive films produced by magnetron-plasmatron sputtering [J]. Thin Solid Films, 1982, 96: 279-284.
  • 10Sproul W D, Tomashek J R. Rapid rate reactive sputtering of metallic compounds [P]. US: 4428812, January 31, 1984.

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