摘要
本文分析了低温放大器中温度应力影响和质量隐患,从芯片和印制板贴装、引线键合和盒体封装三个方面对低温放大器装配工艺进行了研究,给出了低温放大器组装工艺的关键工序,提出了组装工艺改善方法,对低温放大器的组装技术具有一定参考作用。
The temperature stress and latent defects of cryogenic amplifier was analysed. The processes to assemble the cry-genic amplifier, including IC, PCB, wire bonding and case package, were studied. A key process was proposed and a achieve- ment method was provided.
出处
《低温与超导》
北大核心
2017年第6期88-92,共5页
Cryogenics and Superconductivity
关键词
低温放大器
低噪声
高灵敏度
接收机
Cryogenic amplifier, Low noise, High sensitivity, Receiver
