聚酰亚胺/酞菁铜复合薄膜的制备及性能表征

Synthesis and Properties of Polyimide/Phthalocyanine Copper Composite Film

通过原位聚合法在聚酰胺酸溶液中加入酞菁铜粉末,制备不同酞菁铜质量分数的聚酰亚胺/酞菁铜复合薄膜,研究了不同酞菁铜含量对复合薄膜力学性能、光电性能和热稳定性能的影响。结果表明,酞菁铜的加入能够保持复合薄膜的热稳定性,其玻璃化转变温度在356℃左右;复合薄膜的拉伸强度随酞菁铜含量的增加呈现先上升后下降的趋势,当含量为3%时拉伸强度达到最大,而薄膜的弹性模量处于上升的趋势;同时添加一定的酞菁铜,可以有效地改善聚酰亚胺复合薄膜的光电性能,使其在可见光区的最大吸收波长为718 nm,含量为7%时,薄膜的抗静电效果良好。

The polyimide/phthalocyanine copper （PI/CuPc） composite films with different CuPc contents were prepared by in-situ polymerization staring from CuPc in the solution of polyamic acid. Then the effect of CuPc contents on the photoelectric performances, mechanical properties and thermal stability of the PI composite film was investigated. The results show that the addition of CuPc can improve the thermal stability of the composite film, of which the glass transition temperature is about 356 ~C. With the increasing of CuPc content, the tensile strength of the composite film has the trend of first increase and following decrease, and it reaches the maximum with the 3% CuPc addition, while its elastic modulus has a rising trend. The photoelectric performances of the PI composite films are significantly improved when adding suitable content of CuPc, the maximum absorption wavelength is 718 nm in the visible light region and the antistatic effect is good with the CuPc content of 7%.