摘要
SMT(表面贴装技术)是目前电子组装行业里最流行的一种技术和工艺,而焊锡膏是SMT中不可缺少的原料之一,就SMT中关注的焊锡膏成分、分类、特性以及焊锡膏在使用过程中应该注意的问题等加以阐述。
Surface mount technology （SMT） is one of the most popular technology and process in the electronic assembly industry and solder paste is one of the indispensable ingredients in SMT. This paper explores the solder paster in terms of its composition, classification, properties as well as the problems which demands attention associated with the use of the solder paster.
出处
《安徽电子信息职业技术学院学报》
2017年第3期47-50,共4页
Journal of Anhui Vocational College of Electronics & Information Technology
关键词
焊锡膏
表面贴装技术
使用
solder paste
surface mount technology
use
