全彩LED显示屏COB封装模组

COB Package Module with Full Color LED Display

提出了一种点间距为2 mm的全彩LED显示屏COB封装模组的封装工艺方法。COB封装技术的应用,简化了当前表面贴装LED显示屏制造工艺,提高了LED显示屏的像素密度,增强了LED显示屏可靠性,为当前小间距高清高分辨率LED显示屏的封装制造提供了一个可供选择的技术方案。

A COB package of LED display module is presented. The COB display module has a pixel pitch of 2 mm and full color luminescence. Compared with the commonly used surface mount LED display module, COB display module manufacturing process has been greatly simplified. Moreover, the COB display module improves the pixel density of the LED display, and enhances the reliability of the LED display screen. This COB display module is expected to become an alternative technical solution for high resolution, small pitch LED display module.