金凸点倒装芯片性能探讨

Study on Electronic Performance of Flip Chips Basing on Au Bumps

基于成熟、可靠的金凸点制备工艺技术,对微波组件倒装芯片性能进行初步探索和研究。通过超声热压和导电胶粘接两种工艺技术路径均实现了单个芯片与陶瓷板共面波导传输线的互连。测试结果表明,直通模型在40 GHz频段内微波性能优异,说明超声热压和导电胶粘接两种工艺技术实现单个芯片倒装在理论和实践上均是可行性的。

Basing on mature and reliable fabrication for Au bumps, study on electrical performance of flip chip in microwave module was carried out. The interconnect between single chip and Al2O3 ceramic substrate with the model of coplanar waveguide（CPW） acting as transmission line was achieved by thermosonic compression and silver epoxy adhesive. Probe tests showed that the through model had excellent microwave performance in 40 GHz frequency range. It meant that it was feasible to carry out the flip-chip interconnect between single chip and Al2O3 ceramic substrate by the two technological process of thermosonic compression and silver epoxy adhesive in theory and application.