固溶时间对Cu-Ni-Si-Mg合金组织性能的影响

Effects of solid solution time on microstructure and properties of Cu-Ni-Si-Mg alloy

利用光学显微镜(OM)、扫描电镜(SEM)、能谱(EDS)等分析测试手段并结合室温拉伸试验,研究固溶时间对Cu-Ni-Si-Mg合金组织与力学性能及电导率的影响.结果表明:随着固溶时间的延长,冷轧板组织经历了回复、再结晶与晶粒长大,第二相粒子回溶等过程,合金的抗拉强度和屈服强度均表现出先迅速下降,之后趋于平缓的变化趋势,导电率的变化趋势与之大致相同,而延伸率则表现为先增大后减小的变化趋势,其中,固溶时间达到60 s时合金的延伸率达到最大值为52%.

Effects of solid solution time on the organization and mechanical properties Cu-Ni-Si-Mg alloy was studied by optical microscope, scanning electron microscopy, energy spectrum and other analysis of tests methods. The results show that, with the prolonging solid time, the cold rolled plate organization is witnessed a process of recovery, re-crystallization and grain growth, back solution of the secondary phase particle. The yield strength and tensile strength of the alloy increase at first, then decrease. Finally, they tend to be steady. The variation of electrical conductivity rate is observed at a likewise tendency. The elongation reaches its maximize of 52 % at the time of 60s.