IGBT模块结壳热阻快速计算法研究

Study on a Fast Calculation Method of Junction-to-case Thermal Resistance of IGBT Modules

热阻是评价IGBT可靠性的重要指标。寻找简便高精度的测量方法对IGBT热阻进行测试具有十分重要的意义。根据JESD51—14中的瞬态热阻抗定义式,提出了一种可以快速、准确计算IGBT模块结壳热阻的方法。建立了根据不同散热系数下模块结温变化曲线的分离点求解模块结壳热阻的计算模型,制定了试验求解具体步骤。对所提出的方法和所设计的计算模型进行仿真研究和试验研究,并在实验室条件下验证了其可行性。

Thermal resistance is an important index to evaluate the reliability of insulated gate bipolar translator(IGBT). It′ s very significant to find a simple and accurate method to measure the thermal resistance of IGBT.According to the analysis of the transient thermal impedance formula defined in JESD51—14,a fast,accuratecalculation method of the junction-to-case thermal resistance of IGBT module was proposed. A calculation model wasdesigned according to the separation point of the temperature changed curve of the module under different heatdissipation coefficient to solve the catculation merhod of the juntion-to-case resistance module,specific steps of testsolution were also made. The simulation and experimental study of the proposed method and the computational modelwere carried out and its feasibilitied is verified under the laboratory conditions.