微流控芯片注射紫外光固化成型中缺陷形成机理及解决方案研究

Formation Mechanisms and Solutions of Defects in Microfluidic Chips During UV-curing Injection Molding

提出了一种微流控芯片的新型成型方法——紫外(UV)光固化微注射模塑成型,微通道"十"字处和整个基体表面的气泡为其成型的主要缺陷,对后续芯片的使用将会造成很大影响;利用可视化实验研究分析了缺陷的形成原因,并研究了各工艺(注射压力、抽真空、注射方式、光照方式等)对缺陷改善的影响。结果表明,注射方式对"十"字处气泡的形成影响最大,光照方式对基体表面气泡的形成影响最大,通过选用适当的注射方式和光照方式,能够完全解决"十"字处和基体上的缺陷。

This paper reported a new method for the formation of microfluidic chips through UVcuring microinjection molding.Because UV-curable materials were liquid at room temperature and the curing process is performed by chemical reactions,there were a number of differences between UV-curing microinjection molding and conventional microinjection molding.The results from injection-molding experiments indicated that the bubbles appearing near the ＂cross＂of micro channel as well as the whole surface of microfluidic chips were considered as a major defect in the forming process.Such a defect showed a negative effect on the use of microfluidic chips.Formation causes of this defect were analyzed through a visible experiment,and effects of injection pressure,vacuum,injection mode and illumination mode on the defect were investigated,and solutions for elimination of the defect were explored.The results indicated that the injection mode and illumination mode determined the formation of bubbles near the＂cross＂and on the whole surface of microfluidic chips,respectively.The defect could be eliminated completely by adopting suitable injection and illumination modes.