高压力下聚酰亚胺薄膜热激电流的研究

Thermally Stimulated Current Study of Polyimide Film at High Pressures

由于压力参数的引入可以在热激电流（TSC）测量中获得更多实用信息,故自行设计了高压力下测量TSC装置,并且用该装置测量了聚酰亚胺（PI）薄膜在不同压力下的TSC谱和恒温下降低压力时的压激电流（PSC）谱.结果表明:在相同条件下极化的样品,随着压力的增加,其热激电流峰移向高温,压力因素显著地影响聚酰亚胺薄膜的松弛参数.

Since the pressure can lead us to obtain more useful information than that from the conventional TSC measurements, we designed an experimental set-up, which can measure the thermally stimulated current(TSC) curves under high pressures. We have measured the TSC curves of polyimide film at various pressures and piezostimulated current(PSC) curves of polyimide film at a given temperature by the experimental set -up. The results showed that with the increasing pressures, the peaks of TSC curves shifted to higher temperatures. The pressures influence the relaxation parameters of polyimide film.