PCB阻抗测试模块设计研究

Study of PCB Impedance test Module Design

信号高频、高速化发展对PCB阻抗精度要求越来越高。常用PCB阻抗测试模块设计方法缺乏阻抗测试模块的精细化设计,因此测试模块中的测量值不能高精度体现出PCB实际的阻抗值。文章从阻抗线长度、阻抗线尾部状态、阻抗测试孔隔离环宽、阻抗线与周边铺铜间距共四个因素设计不同的阻抗测试模块,研究与实验PCB阻抗测试模块的最佳设计。

Signal＇s high frequency, high speed development of PCB impedance accuracy requirements are getting higher and higher. The commonly used PCB impedance test module design method lacks the fine design of the impedance testing module, so the measured values in the test module can not reflect the actual impedance value of PCB. In this article shows four different factors design of impedance test module ：the impedance line length, line tail status, test hole isolation ring width, line and the surrounding copper spacing, study and do Experiments to choice the best disgn for PCB impedance test module.