基片集成脊波导毫米波板间垂直互联结构研究

A Vertical Interconnection for Millimeter-Wave SOP Applications Based on Substrate Integrated Ridged-Waveguide

在毫米波系统级封装(System-On-Package,SOP)中,需要一种宽带、小型化、易集成的板间垂直互联电路,以实现不同功能层之间毫米波信号的可靠互联。不同于常规基片集成波导(SIW),提出一种基于Z向基片集成脊波导(Substrate-Integrated-Riged-Waveguide,SIRW)的毫米波板间垂直互联结构。该结构体积小、易集成,可与多层基板加工工艺兼容、一体化同步实现。最后利用低温共烧陶瓷(Low Temperature Co-fired Ceramic,LTCC)加工工艺,制作了背靠背互联实物,电路接口尺寸2.2 mm×1.3 mm,经测试在28~36 GHz频带内实现单个互联插损小于0.45dB,带内平坦度优于±0.5 dB,回波损耗优于-12 dB。

In millimeter-wave（MM-W） system on package （SOP）, a broadband and miniaturized vertical interconnec- tion circuit is required, for the MM-W signal＇ s transition between different functional layers. Different from normal substrate integrated waveguide （SIW）, a novel Z-direction substrate integrated rigged waveguide （SIRW） is proposed, which is used for making up of the vertical interconnection. The interconnection structure is compatible with standard PCB manufacturing process, and can be realized with the substrate synchronously. Finally, a back-to-back circuit is fabricated in LTCC sub- strates. The dimension of port is 2.2 mmx 1.3 mm. In 28 -36 GHz band, the insertion loss is less than 0.45 dB, vibration is less than ＋0.5 dB , and return loss is better than -12 dB.