摘要
以某PCB(印制线路板)厂的酸性CuCl_2蚀刻废液为原料,采用液相法制备Cu_2O,并对其中的NaCl进行回收。研究了水合肼与废液中Cu^(2+)的浓度比、pH、反应温度、时间等参数对Cu_2O纯度的影响,得到最佳工艺条件为:先在水合肼与Cu^(2+)的浓度比为0.2625、pH=4~5和室温之下沉淀和还原,再在pH=12、100 ℃之下取代和脱水反应1 h。所得Cu_2O的纯度达98.4%,铜杂质含量小于0.07%,满足HG/T 2961–2010中优等品的要求。回收的NaCl纯度高于97.5%,符合GB/T 5462–2015中二级精制工业盐的要求。
Cu2O was prepared by liquid phase method using a spent acid CuCl2 etching solution from a PCB (printed circuit board) factory as raw material, and NaCl was reclaimed. The effect of process parameters including the concentration ratio of hydrazine hydrate to Cu^2+ in the spent etching solution, pH, as well as reaction temperature and time on the purity of Cu2O were studied. The optimal process conditions are as follows: precipitation and reduction at hydrazine hydrate-to-Cu^2+ concentration ratio of 0.2625, pH 4-5 and room temperature followed by substitution and dehydration at pH 12 and temperature 100℃ for 1 h. The purity of the obtained Cu2O under the optimal conditions reaches 98.4% with the content of copper impurity less than 0.07%, meeting the requirement of high-class product stipulated by HG/T 2961-2010 standard. The purity of the reclaimed NaCl is above 97.5%, meeting the GB/T 5462-2015 standard for secondary refined industrial salt.
出处
《电镀与涂饰》
CAS
CSCD
北大核心
2017年第11期594-598,共5页
Electroplating & Finishing
关键词
酸性氯化铜蚀刻液
氧化亚铜
氯化钠
还原
脱水
回收
acidic copper chloride etching solution
cuprous oxide
sodium chloride
reduction
dehydration
reclamation