期刊文献+

从酸性氯化铜蚀刻废液中回收氧化亚铜和氯化钠 被引量:1

Reclamation of cuprous oxide and sodium chloride from spent acidic copper chloride etching solution
下载PDF
导出
摘要 以某PCB(印制线路板)厂的酸性CuCl_2蚀刻废液为原料,采用液相法制备Cu_2O,并对其中的NaCl进行回收。研究了水合肼与废液中Cu^(2+)的浓度比、pH、反应温度、时间等参数对Cu_2O纯度的影响,得到最佳工艺条件为:先在水合肼与Cu^(2+)的浓度比为0.2625、pH=4~5和室温之下沉淀和还原,再在pH=12、100 ℃之下取代和脱水反应1 h。所得Cu_2O的纯度达98.4%,铜杂质含量小于0.07%,满足HG/T 2961–2010中优等品的要求。回收的NaCl纯度高于97.5%,符合GB/T 5462–2015中二级精制工业盐的要求。 Cu2O was prepared by liquid phase method using a spent acid CuCl2 etching solution from a PCB (printed circuit board) factory as raw material, and NaCl was reclaimed. The effect of process parameters including the concentration ratio of hydrazine hydrate to Cu^2+ in the spent etching solution, pH, as well as reaction temperature and time on the purity of Cu2O were studied. The optimal process conditions are as follows: precipitation and reduction at hydrazine hydrate-to-Cu^2+ concentration ratio of 0.2625, pH 4-5 and room temperature followed by substitution and dehydration at pH 12 and temperature 100℃ for 1 h. The purity of the obtained Cu2O under the optimal conditions reaches 98.4% with the content of copper impurity less than 0.07%, meeting the requirement of high-class product stipulated by HG/T 2961-2010 standard. The purity of the reclaimed NaCl is above 97.5%, meeting the GB/T 5462-2015 standard for secondary refined industrial salt.
出处 《电镀与涂饰》 CAS CSCD 北大核心 2017年第11期594-598,共5页 Electroplating & Finishing
关键词 酸性氯化铜蚀刻液 氧化亚铜 氯化钠 还原 脱水 回收 acidic copper chloride etching solution cuprous oxide sodium chloride reduction dehydration reclamation
  • 相关文献

参考文献6

二级参考文献58

共引文献39

引证文献1

二级引证文献1

相关作者

内容加载中请稍等...

相关机构

内容加载中请稍等...

相关主题

内容加载中请稍等...

浏览历史

内容加载中请稍等...
;
使用帮助 返回顶部