球栅阵列可焊性测试

Wetting Balance Test for BGA Devices

在武器装备系统中,可焊性测试是鉴定电子元器件引出端质量和共面工艺等指标的一项重要措施。尤其在装机前,因为可焊性的隐患可能带来无法估量的损失。在检测分析工作中,使用什么方法正确评估电子元器件的可焊性显得尤为重要。通过球栅阵列器件的可焊性测试方法的分析研究,对测试中遇到的问题进行归纳和总结,以具体的示例进行分析和验证,提出了BGA可焊性测试中可参考的标准、应注意的问题等,为同行业者提供指导和借鉴。

In order to reduce the loss and recurrence difficulty as much as possible, it is necessary to do much experiments or tests to ensure the quality and reliability of the electronic components in military weapon system,especially before the whole system is completely loaded. Wetting Balance Test is an important method used to judge the specifications such as the interface soldering properties and coplanarity properties. It is very important to test the solderability of the electronic components for the detection and analysis department. The paper analyzes the problems occurred during the test of BGA device and provides some suggestions on Wetting Balance Test covering standards and precautions.