机载光电产品关键部件热仿真研究

Thermal Simulation to Critical Components of Airborne Photoelectrical Equipment

在温度发生变化以及温度不均匀的情况下,机载光电产品的结构零件和光学元件会发生变形,从而影响其光学系统性能;此外,温度过高或过低会降低关键元器件的可靠性与工作寿命。因此,机载光电产品设计时,进行热仿真评估尤为重要。机载光电产品中,探测器和印制板是最主要的发热元器件,因此如何提高其热仿真精度是提高评估有效性的关键。通过对探测器和印制板的组成、工作原理、常规热仿真建模方法等进行分析,提出了改进的热仿真建模方法。经过试验验证,改进的热仿真建模方法大幅度提高了仿真精度,提高了热仿真评估的有效性。

When the temperature changes or is not uniform, the structural and optical elements of airborne photoelectrical equipment would deform, which may have effect on the optical system performance. In addition, too high or too low temperature may decrease the reliability and life of the critical elements. Therefore, it is very important to carry out thermal simulation and evaluation in design of the airborne photoelectrical equipment. The detector and PCBs are the main hot elements of the airborne photoelectrical equipment. So, how to improve the precision of thermal simulation becomes the key point to improve the validation of evaluation. In this paper, the composition, working principle, normal thermal modeling method of detector and PCB are presented, and an improved modeling method of the thermal simulation is given. Experimental verification results show that the precision of the proposed thermal simulation is improved remarkably, and thus the validation of evaluation is improved.