摘要
随着集成电路的集成度和脉冲信号速度的提高,电路中的波效应越来越明显,单纯使用电路分析方法已不能满足精度要求,这种情况下必须对原问题分而治之.采用3维电磁场全波方法对封装与互连结构进行分析,采用电路分析方法对电路元件或电路模块进行分析,最后将二者耦合起来实现场路协同仿真.论文首先对计算电磁学中的场路协同仿真问题进行分类,然后分别介绍各类场路协同仿真的国内外研究现状,最后探讨场路协同仿真的未来研究方向.
With the improvement of integration density and the speed of pulse signal, the wave effect is more and more obvious in integrated circuit. So it cannot meet the accuracy requirement by solely utilizing the circuit analysis method. Divide-and-conquer method must be adopted under such circumstances. The full-wave method can be used to analyze complex packaging and interconnected structure. The circuit analysis method can be adopted to analyze the circuit components and modules. Finally the full-wave method and the circuit analysis method can be coupled together to implement the cosimulation of electromagneticscircuit systems. In this article, the problems of electromagnetics-circuit cosimulation were classified firstly. Then the overseas and domestic research status of each kind of problem was introduced. At last, the future research direction on electromagnetics-circuit cosimulation was discussed.
出处
《安徽大学学报(自然科学版)》
CAS
北大核心
2017年第4期3-9,共7页
Journal of Anhui University(Natural Science Edition)
基金
国家自然科学基金资助项目(61271158)
中央高校基本科研业务费资助项目(JB160218
XJS16048)
关键词
电磁兼容
场路协同仿真
全波方法
electromagnetic compatibility
eosimulation of electromagnetics-circuit systems
full wave method