摘要
采用SM952溶解液溶解PCB焊锡料测定铜镍含量,经与经典王水溶解测定法比较,该方法快速、准确、可靠,对公司的时间成本节约具有重要的现实意义。
In this paper, a SM952 solution was used to dissolve the sample of soldering-tin material for determination of the content of Cu and Ni. Comparing with the traditional aqua regia method, this method was rapid, accurate and reliable which had real significance for the time cost savings for the company.
作者
黄仲华
张然咸
黄少南
寻瑞平
HUANG Zhong-hua ZHANG Ran-xian HUANG Shao-nan XUN Ruioping
出处
《印制电路信息》
2017年第7期43-45,共3页
Printed Circuit Information
关键词
印制电路板
焊锡料
铜镍含量
原子吸收法
PCB
Soldering-tin Material
Content of Cu and Ni
Atomic Absorption Method
