玻璃粉对铜导体浆料烧结膜性能的影响

Effect of Glass Powder on Performance of Copper Conductor Film Prepared via Sintering Cu-glass Paste

使用不同组成和含量的玻璃粉配制铜浆,将其印在Al_2O_3基片表面并在850℃烧结后得到铜膜,研究玻璃粉对铜膜的导电性和附着力等性能的影响。用四探针法测定铜膜方阻,使用拉力试验机测定铜膜附着力。用金相显微镜、X射线衍射仪(XRD)、扫描电子显微镜(SEM)以及热重分析仪(TGA)等手段对铜膜的显微组织、物相、形貌以及玻璃粉物理化学性质进行了表征。结果表明,组成为SiO_2-B_2O_3-ZnO的G3玻璃粉的玻璃性能良好且其转变温度合适,制备出的铜膜试样表面平整,微观组织致密,导电性好。当G3玻璃粉含量(质量分数)为4.8%时铜膜的方阻为9.5 mΩ/,与Al_2O_3基体间的附着力为24 N/mm^2。为了验证铜膜在使用过程中的可靠性,测试了G3-3铜膜的抗氧化和老化性能。结果表明,G3-3铜膜在室温氧化28 d后平均增重率为3.5%,电阻变化率的平均值为0.79%;在20℃~160℃高温老化后铜膜的电阻变化率平均值为12.63%、平均增重率为4.63%,具有良好的抗氧化性和抗老化性能。

Copper pastes with different glass powders were prepared and then printed on Al_2O_3 substrate and finally sintered at 850℃ to produce Cu film on the Al_2O_3 substrate surface. The produced Cufilms and glass powder were characterized by means of metallographic microscope, X-ray diffractometer,scanning electron microscope and thermo gravimetric analyzer. While the effect glass powder on the conductivity and adhesive performance of Cu films was also assessed. The results show that glass powder G3 composited of SiO_2-B_2O_3-ZnO possesses appropriate transition temperature, with which a compact copper film with flat surface and good electrical conductivity can easy be made. When the Cu-paste with4.8 mass% of glass powder G3, the produced Cu-film presents electrical resistance of 9.5 mΩ/□ and adhesive strength of 24 N/mm^2 to the Al_2O_3 substrate. In order to verify the reliability of Cu-film in service,the oxidation resistance and aging properties of Cu-film G3-3 were examined. It was found that the average mass gain rate of the Cu-film was 3.5% after 28 days oxidation at room temperature, the resistance change average rate was 0.79%. After aging test at 20~160oC for 12 h, the average change rate of the Cu-film resistance was 12.63% and the average mass gain rate was 4.63%, which demonstrated that film has the good oxidation resistance and anti-aging performance.