用于降低接触热阻的复合黏结材料的制备优化

Preparation and optimization of compound bonded material used in reducing the contact thermal resistance

基于提高吸附床的导热性能,研制一种可涂于吸附床与吸附剂之间降低接触热阻的耐高温耐腐蚀的高导热复合黏结材料。通过稳态试验研究导热填料、稀释剂与偶联剂等因素对复合黏结材料热导率的影响,采用正交试验方法优化复合黏结材料的配制方案。研究结果表明:复合黏结材料的导热性能随着Al_2O_3导热填料的质量分数的增加而提高,采用10μm Al_2O_3导热填料粒子的导热性能略高于采用35μm Al_2O_3导热填料粒子的复合黏结材料,10μm Al_2O_3导热填料粒子用质量分数8%的偶联剂处理,复合黏结材料的热导率最高。采用适当配比的导热填料、稀释剂与偶联剂能显著提高复合黏结材料的热导率。

To enhance the global thermal conductivity of adsorbed bed, heating resistingand corrosion-resistant compos- ite bonded material with high thermal conductivity was studied. It could be daubed between adsorbed bed and adsorbent for decreasing thermal contact resistance. The article experimental researched the influence of thermal conducting filler, diluent and coupling reagent and other factors on composite bonded materials thermal conductivity at first. And then confecting project of composite bonded material with orthogonal experiment was optimized. The research results showed that the thermal properties of the compositebonded material improved with the percentage of thethermal conducting filler Al2O increasing, composites with 10 μm Al2O3 fillers had better thermal performance than the composites with 35μm Al2O3 fillers. For 10 μm Al2O3 fillers, which treated by 8% concentration coupling agent had the highest thermal con- ductivity. The thermal conductivity of the composites could be significantly improved by using the appropriate ratio of the thermal conductive fillers, diluents and coupling agents.