期刊文献+

Design and simulation of a novel E-mode GaN MIS-HEMT based on a cascode connection for suppression of electric field under gate and improvement of reliability

Design and simulation of a novel E-mode GaN MIS-HEMT based on a cascode connection for suppression of electric field under gate and improvement of reliability
原文传递
导出
摘要 We proposed a novel Al Ga N/Ga N enhancement-mode(E-mode) high electron mobility transistor(HEMT) with a dual-gate structure and carried out the detailed numerical simulation of device operation using Silvaco Atlas. The dual-gate device is based on a cascode connection of an E-mode and a D-mode gate. The simulation results show that electric field under the gate is decreased by more than 70% compared to that of the conventional E-mode MIS-HEMTs(from 2.83 MV/cm decreased to 0.83 MV/cm). Thus, with the discussion of ionized trap density, the proposed dual-gate structure can highly improve electric field-related reliability, such as, threshold voltage stability. In addition, compared with HEMT with field plate structure, the proposed structure exhibits a simplified fabrication process and a more effective suppression of high electric field. We proposed a novel Al Ga N/Ga N enhancement-mode(E-mode) high electron mobility transistor(HEMT) with a dual-gate structure and carried out the detailed numerical simulation of device operation using Silvaco Atlas. The dual-gate device is based on a cascode connection of an E-mode and a D-mode gate. The simulation results show that electric field under the gate is decreased by more than 70% compared to that of the conventional E-mode MIS-HEMTs(from 2.83 MV/cm decreased to 0.83 MV/cm). Thus, with the discussion of ionized trap density, the proposed dual-gate structure can highly improve electric field-related reliability, such as, threshold voltage stability. In addition, compared with HEMT with field plate structure, the proposed structure exhibits a simplified fabrication process and a more effective suppression of high electric field.
出处 《Journal of Semiconductors》 EI CAS CSCD 2017年第7期49-55,共7页 半导体学报(英文版)
基金 supported by the Key Technologies Support Program of Jiangsu Province(No.BE2013002-2) the National Key Scientific Instrument and Equipment Development Projects of China(No.2013YQ470767)
关键词 GaN HEMT enhancement-mode electric field distribution V_(th) instability GaN HEMT enhancement-mode electric field distribution V_(th) instability
  • 相关文献

参考文献1

二级参考文献13

  • 1Wu Y F, Saxler A, Moore M, et al. 30-W/mm GaN HEMTs by field plate optimization. IEEE Electron Device Lett, 2004, 25(3): 117.
  • 2Daumiller I, Kirchner C, Kamp M, et al. Evaluation of the tem- perature stability of A1GaN/GaN heterostructure FETs. 1EEE Electron Device Lett, 1999, 20(9): 448.
  • 3Khan M A, Chen Q, Sun C J, et al. Enhancement and depletion mode GaN/A1GaN heterostructure field effect transistors. Appl Phys Lett, 1996, 68(4): 514.
  • 4Wang R, Cai Y, Cheng Z, et al. A planar integration process for E/D-mode A1GaN/GaN HEMT DCFL integrated circuits. IEEE Compound Semiconductor Integrated Circuit Symposium, 2006: 261.
  • 5Ross T N, Hettak K, Cormier G, et al. Design of X-band GaN phase shifters. 1EEE Trans Microwave Theory & Tech, 2015, 63(1): 244.
  • 6Cao Mengyi, Lu Yang, Wei Jiaxing, et al. Ka-band full-360 ana- log phase shifter with low insertion loss. Journal of Semiconduc- tors, 2014, 35(10): 105005.
  • 7Xie Yuanbin, Quan Si, Ma Xiaohua, et al. Monolithically inte- grated enhancement/depletion-mode A1GaN/GaN HEMT D flip- flop using fluorine plasma treatment. Journal of Semiconductors, 2011, 32(6): 065001.
  • 8Quan Si, Hao Yue, Ma Xiaohua, et al. Enhancement-mode A1- GaN/GaN HEMTs fabricated by fluorine plasma treatment. Jour- nal of Semiconductors, 2009, 30(12): 124002.
  • 9Yan D, Jiao J, Ren J, et al. Forward current transport mecha- nisms in Ni/Au-A1GaN/GaN Schottky diodes. J Appl Phys, 2013, 114(14): 144511.
  • 10Cai Y, Zhou Y, Lau K M, et al. Control of threshold voltage of A1GaN/GaN HEMTs by fluoride-based plasma treatment: from depletion mode to enhancement mode. IEEE Trans Electron De- vices, 2006, 53(9): 2207.

相关作者

内容加载中请稍等...

相关机构

内容加载中请稍等...

相关主题

内容加载中请稍等...

浏览历史

内容加载中请稍等...
;
使用帮助 返回顶部