SnZnPr-xAu无铅钎料性能与组织

Properties and Microstructures of SnZnPr-xAu Solders

研究了微量纳米Au颗粒对SnZnPr无铅钎料性能与组织的影响。研究结果表明,微量的纳米Au颗粒可以显著改善SnZnPr钎料的润湿性和焊点力学性能,通过优化设计证明纳米Au颗粒的最佳添加量为0.1%,但添加纳米Au颗粒过量时,钎料的润湿性明显下降,焊点的力学性能基本不变。对SnZnPr和SnZnPr-0.1Au钎料组织研究发现0.1%纳米Au颗粒可以显著细化基体组织,特别是减小富Zn相的尺寸,通过纳米压痕实验证明0.1%纳米颗粒可以显著提高SnZnPr钎料的抗蠕变性能,热循环实验证明0.1%纳米Au颗粒可以将QFP100器件SnZnPr焊点热疲劳寿命提高12.3%,主要归因于纳米颗粒对位错的钉扎作用。

The properties and microstructures of SnZnPr solders were studied with the addition of Au nanoparticles. The results indicat that the addition of Au nanoparticles can enhance the wettability of solder and the mechanical property of solder joints, the optimum content of Au nanoparticles is 0.1% with optimal design. However, excessive Au nanoparticles can degrade the wettability of solders, and no variation occurs for mechanical property of solder joints. With the microstructure observation of SnZnPr and SnZnPr-0.1Au solders, the 0.1% Au nanoparticles can refine the matrix microstructure of SnZnPr solder, especially for reduction of rich-Zn phases. Moreover, with the addition of 0.1% Au nanoparticles, nanoindentation testing indicates that the creep-resistance property can be enhanced obviously, thermal fatigue life of solder joints is increased by 12.3% with thermal cycling testing, which can be attributed to dislocation pinning effect of nanoparticles.