铜粉表面磷化工艺优选

Optimization of Phosphating Process of Copper Powder Surface

为提高铜粉的抗氧化性能,以氧化锌、磷酸、硝酸配制磷化液,通过单因素试验进行铜粉磷化工艺优选,采用扫描电镜、X射线衍射仪、激光粒度仪及烧结试验等研究了磷化液成分、磷化时间、磷化温度对所得磷化铜粉形貌、粒径和抗氧化性能的影响。结果表明:铜粉磷化后在150℃时抗氧化性得到较大改善,在300~400℃之间的抗氧化能力明显提高,但在400℃时,铜粉的抗氧化能力改善相对较小;磷化的最佳工艺为A磷化体系(8 g Zn O,14 m L HNO3,7 m L H3PO4,250 m L H2O)、磷化温度65℃、磷化时间40 min;最佳条件下磷化,能够获得粒径分布更均匀、分散性和抗氧化性更好的类球形铜粉。

In order to improve the oxidation resistance of copper powder,zinc oxide,phosphoric acid and nitric acid were used to formulate phosphate solution,and the phosphating process was optimized by single factor experiment.SEM,XRD,laser particle analyzer and sintering tests were used to study the effects of different solution components,phosphating time and temperature on the morphology,grain size and oxidation resistance of phosphatized copper powder.Results showed that the oxidation resistance of copper powder after phosphating process was significantly improved at 150 ℃.Between 300 ℃ and 400 ℃,the antioxidant capacity of copper increased significantly,but the improvement of the oxidation resistance of copper powder was comparatively small at 400 ℃.The optimized process was as follows：phosphate system A （8 g ZnO,14 mL HNO3,7 mL H3PO4,250 mL H20）,phosphating temperature 65 ℃,phosphating time 40 min.Under the optimal process,the phosphatized copper powder was more uniform in size and better-dispersed,and had better oxidation resistance.