铜基无颗粒型导电墨水的性能研究

Properties of Copper-based Particle-Free Conductive Ink

目的通过测定导电涂层电阻率来确定导电墨水的最佳制备工艺参数。方法以醋酸铜为前驱体,N,N-二甲基乙醇胺为络合剂,甲酸为还原剂,制备导电性高的铜基无颗粒型导电墨水。采用化学还原法制备铜基无颗粒型导电墨水,通过正交实验研究烧结温度、烧结时间以及Cu2+∶H+∶NH4+的比例对涂层导电性的影响,确定最佳的制备工艺。结果制备的铜基无颗粒型导电墨水在弱碱性环境下较稳定,墨水中的Cu2+,H+,NH4+的最佳物质的量之比为1∶3∶3。该配方的墨水具有很高的稳定性能和导电性能,在玻璃基材上滴涂经160℃下热处理30 min,得到的涂层电阻率仅为0.18μ?·m。结论初步实现了铜基无颗粒型导电墨水的低温烧结。

The work aims to determine the best preparation process parameter of the conductive ink by measuring the resistivity of conductive coating. Taking copper acetate as precursor, N,N-Dimethylethanolamine as complexing agent, and formic acid as reductant, the copper-based particle-free conductive ink of high conductivity was prepared. Copper-based particle-free conductive ink was prepared in chemical reduction method. The influence of the sintered temperature and time, and the ratio of Cu2＋∶H＋∶NH4＋ on the coating conductivity was studied through orthogonal experiment to determine the best preparation process. The copper-based particle-free conductive ink with the optimal mole ratio of Cu2＋∶H＋∶NH4＋ in the ink of 1∶3∶3 was stable in weak alkaline. The ink with optimal formula possessed high stability and conductivity. With the ink dropped and applied on the glass substrate to be cured for 30 min at 160 ℃, the coating resistivity obtained was only 0.18 μ？·m. In conclusion, the low-temperature sintering of copper-based particle-free conductive ink is primarily achieved.