虚拟切片无损测量片层质量检测系统优化研究

Research on Precision Optimization of Inspection System Fornon-destructive Measurement of Chip Layer Mass via Virtual Slice

基于虚拟切片无损测量方法具有测量精度高、成本低、数据测量与处理快、可测量物体内部轮廓等特点。由于测量质量精度高,其测量装置中精密片层质量检测系统精度是研究的关键技术之一,直接影响微小单元体质量的计算精度。运用误差补偿与误差影响因素正交实验等技术手段,对精密片层质量检测系统的误差分析及优化。实验结果证明,实现了片层质量平均相对误差从19.36%降至5.52%,并且在各片层厚度条件下,相对误差皆保持平稳幅度。

nondestructive measurement method via virtual slice has high accuracy, low cost of measurement, fast measurement and processing of data and which can be measured inside the object contour, due to high accuracy of mass measurement. The measurement accuracy of inspection system for precision slice massis one of the key technologies, directly affect the calculation accuracy of micro element body mass. Using the error compensation and orthogonal experiment of error influencing factors the error of inspection system of precision slice mass was analyzed and the system was optimized. The present results prove that the average relative error of slice mass decreased from 19.36% to 5.52%, and all of the relative error remain stable amplitude under various layer thickness.