层压压强对LTCC基板烧结收缩率的影响研究

Research of Laminating Pressure Effect on Sintering Shrinkage of LTCC Substrate

LTCC技术是高可靠性、高集成度和高性能电路基板制造技术之一。运用实验的研究方法,详细探究了层压压强对LTCC基板烧结收缩率的影响。同时从理论上分析了这一影响产生的机理。

LTCC technology is an advanced circuit board manufacturing technology for high reliability, high integration and high performance IC substrates. In the paper, the effect of the laminating pressure on the sintering shrinkage of LTCC substrate is investigated in detail and the mechanism of the effect is analyzed theoretically.