摘要
介绍了相控阵天线中使用的一种X波段多联装高集成度T组件,简述了该组件的原理电路、设计思想及相关工艺。在器件选型中,利用集成数个微波单片的多功能芯片,缩小组件面积。在结构布局上,合理安排各微波单片集成电路单元,利用异形结构减弱腔体效应。采用微组装工艺,设置合理的温度梯度和装配手段,提高产品可靠性。该T组件在X波段9~12 GHz带宽范围内,连续波条件下工作输出功率大于6 W,移相均方根误差小于3°。
An X-band high power 4-channel T module for phased array antenna is presented in the paper. The principle, design idea and micro-assembly processes are discussed. In order to reduce the module volume, the multifunction-chip integrates several monolithic microwave integrated circuits (MMICs). The weak cavity effect enables reasonable placement of circuit units in the module architecture. In the micro-assembly processes, reasonable temperature gradients and assemble technology are used to control product reliability. The rest results show that output power of the T module is more than 6 W and less than 3° of root mean square (RMS) phase error in the range of 9 GHz-12 GHz.
出处
《电子与封装》
2017年第7期36-39,共4页
Electronics & Packaging
关键词
X波段
T组件
多功能芯片
腔体效应
相位精度
X-band
transmit module
multifunction-chip
cavity effect
phase shift accuracy