摘要
通过等离子轰击可以有效提高金丝键合的可靠性。氩气等离子清洗后,基板容易金丝键合,破坏性拉力测试后键合点留压点,键合力有明显提高。5880基板最优的清洗参数是功率200 W,清洗时间600 s,气体流量150 ml/min,并且等离子处理之后2 h内完成键合,效果最佳。
Wiring bonding reliability can be effectively improved by plasma cleaning. In the paper, the surface of substrate presents better wire bonding performance after cleaned by Ar plasma and the bonder remains after pulling test. The best parameters for 5880 substrate include 200 W ultrasonic power, 600 s cleaning time and 150 ml/min gas flow. Wire binding within 2 hours after cleaning achieves the best performance.
出处
《电子与封装》
2017年第7期40-42,共3页
Electronics & Packaging
基金
国家自然科学基金项目(61404119)
关键词
等离子
金丝键合
清洗参数
plasma
wire bonding
cleaning parameters
