摘要
针对宽带高频组件的发展趋势,研究了三种不同的适用于宽带高频信号的传输结构。主要介绍了三种传输结构的设计方案,并利用HFSS软件对传输结构进行仿真优化,最后进行了实物分析验证。经过测试,在宽带高频信号下,三种结构均有比较良好的电性能传输特性。该测试结果表明,宽带高频组件的设计中可以根据实际需求运用多种传输结构实现较高的性能指标,具有广泛的应用前景。
Proceeding from the development path of wide-band and high-frequency components, the paper conducts certain researches and presents designs of three different transmission structures for wide-band and high-frequency signal. The HFSS soRware is used to stimulate and optimize the structure of transmission. Three structures of transmission are verified and analyzed practically. After tests, three structures all have a high electronic quality. The structures can be applied flexibly in scenarios with various requirements to achieve higher electronic performance in the design of the wide-band and high frequency components. The structures will be widely applied in many fields.
出处
《电子与封装》
2017年第7期43-47,共5页
Electronics & Packaging
关键词
宽带高频
传输结构
HFSS仿真
wide-band and high-frequency
transmission structure
HFSS stimulation