摘要
梳理了数字电路封装串扰测试方法的发展历史,总结了串扰的影响因素。基于对业界串扰测试方法的分析,比较了各种方法间的区别和优缺点,分析了美军标MIL-STD-883K中串扰测试方法很少修订却长期存在的原因。明确了美军标及其他串扰测试方法的适用范围,提出了我国相应标准制修订方向的建议。测试结果表明,标准中的现有方法在评估串扰对整体电路影响方面手段有欠缺,需要结合电磁仿真对串扰影响做出整体评估,并利用实际测试对仿真结果进行校准,从而提高模拟的准确度,此方法可以在我国相应标准的制修订中加以采用。
This paper presents the history ofcrosstalk test method and summarizes the factors of crosstalk. Based on the analysis of the crosstalk test methods used in the industry, the differences, advantages and disadvantages of the methods are compared. Analyzing the reason why crosstalk test in the standard method is rarely revised, the paper proposes the applicability of the crosstalk test methods in MIL-STI〉883K and the industry, and revision directionsforour correspond ing standard in China. The test results show that the electromagnetic simulation tools need to be used to estimate the crosstalk influence integrally and can be used in the corresponding standards in China.
出处
《国外电子测量技术》
2017年第6期14-21,共8页
Foreign Electronic Measurement Technology
关键词
串扰
容性耦合
感性耦合
串扰模型
crosstalk
capacitive couple
inductive couple
crosstalk model
