晶硅片切割用水基切割液摩擦学性能的研究

Friction Properties of Water-based Cutting Fluid for Crystal Wafer Cutting

重点研究了晶硅片切割用水基切割液中润滑剂的摩擦性能影响因素。选用低分子量的聚乙二醇(PEG)作为润滑剂,研究了不同分子量PEG作为润滑剂的摩擦学性能。在使用PEG300作为水基切割液润滑剂的情况下,相比纯水可减小硅片表面的粗糙度达86.51%;磨损体积可以减少50%,磨损表面磨屑变少。

Influence factors of the friction performance of the lubricating agent in the water-based cutting fluid for crystal wafer cutting were mainly studied. The low molecular weight polyethylene glycol（ PEG）was used as the lubricant,and the tribological properties of PEG with different molecular weight were analysized. In the case of using PEG300 as a water-based cutting fluid lubricant,it is possible to reduce the roughness of the surface of the wafer by more than 86. 51% compared with pure water; the wear volume can be reduced by 50% and the wear surface of the worn surface is reduced.