薄膜微结构的制备工艺研究

Research on Fabrication Technology of Micro-Structure of Thin Film

为了研究薄膜微结构在折射、反射和衍射的基础上引入干涉效应后的光学特性,用于实现对光波的复杂调制.主要对薄膜微结构的制备工艺进行了研究.实验中使用等离子体增强化学气相沉积技术(PECVD)在单抛硅片(晶向100)上沉积得到厚度为3.04μm的氧化硅薄膜,使用单点金刚石技术在铝表面飞切尺寸为宽42μm、高2μm的周期性微结构作为压印用的母版.利用纳米压印结合电感耦合等离子体(ICP)刻蚀技术将微结构转移到氧化硅薄膜上,采用光学显微镜和接触式轮廓仪分别对微结构的表面形貌和轮廓进行了分析,最后对制备薄膜微结构过程中产生的偏差进行了分析.研究结果表明:测得微结构实际尺寸为宽42.20μm、高1.86μm,相对误差为宽0.4%、高7%.

Though the thin film＇s microstructure,the complex modulation of light waves on the basis of refraction,reflection and diffraction can be realized.The preparation technology of thin film＇s microstructure is mainly studied.The silicon oxide thin films with thickness of 3.04μm are deposited on a single wafer（100）by using PECVD technique.With single point diamond technology,the micro structure with width of 42μm and height of 2μm on surface of aluminum is cut,which is used as the master plate for imprinting.The microstructure is transferred to the silicon oxide thin film by nano imprint lithography and ICP etching technique.The surface morphology and profile of the microstructure are analyzed by optical microscope and contact profilometer.Finally,the deviation in the process of preparing is analyzed.The results are as follows：The actual size is 42.20μm,the height is up to 1.86μm,and the relative error is 0.4% of width and up to 7% of height.