摘要
为了在提高芯片测试覆盖率的同时减少生产测试时的测试向量,提出了一种基于对电路进行抗随机向量故障分析,进而在电路中插入测试点,从而提供芯片的测试效率的方法。实际电路的实验结果表明,使用了该方法的可测性设计,在不损失测试覆盖率的情况下,能够有效地减少平均45.85%的测试向量,从而帮助设计者提高芯片的测试效率。
To improve manufacturing test coverage as well as to reduce the test pattern volume,a method based on Random Resis-tant Fault Analysis（RRFA） is proposed.This method will improve the test efficiency by inserting test points in the circuit.The ex-perimental results on real designs show that using this method effectively reduce test patterns by 48.85 % without losing test cover-age,which helps chip designer to improve test efficiency.
出处
《电子技术应用》
北大核心
2017年第8期40-42,共3页
Application of Electronic Technique
