一种用于挠性板装联的工艺方法研究

Study of Process Technology Used for Flexible Printed Circuit Board Assembly

以挠性板和儿CC陶瓷封装器件为研究对象,从焊接辅助工装设计、器件焊接方法、器件固封、环境试验和金相分析等方面研究了以STAR1000图像传感器为代表的儿CC陶瓷封装器件在挠性板上的装联工艺技术。研究表明,通过设计合理的焊接辅助工装,采用正确的焊接和固封方法,能够获得合格且质量稳定的焊点。金相分析结果表明,经过一系列的环境试验,焊点满足指标要求。

Took flexible plate and JLCC ceramic packaging device as the research object,took STAR1000 image sensor as example to study the packaging process technology that JLCC ceramic packaging device mounted on the flexible printed circuit board from the fixture design of soldering,soldering method,underfill technology,environmental testing and metallographic analysis.The results shown that qualified solder joint with stable quality can be achieved with reasonable fixture design of soldering,correct soldering and underfill method.Metallographic analysis results shown that the solder joint meet the index requirements after a series of environmental testing.