BGA球窝焊点切片特征与形成机理及控制

Section Features and Formation Mechanism and Control of Head-InPillow Solder Joint of BGA

球窝现象(HoP、HiP)是BGA常见的焊接不良,简要介绍了其切片特征、形成机理、产生原因、常见应用场景、X-Ray的检测与判别和防控方法。

the phenomenon of Head-on-Pillow （HOP） or Head-ln-PUlow （HIP） is the common defect of BGA solder joint. Introduce the section features, formation mechanism, causing reason, common application scenarios, X-Ray inspection and criteria as well as prevention methods of Head-on-Pillow （HOP） or Head-In- Pillow （HIP） defect of BGA solder joint.