摘要
总结了化学镀法制备镀银铜粉的研究进展。介绍了以甲醛、葡萄糖、水合肼、抗坏血酸等单一还原剂和复合型还原剂参与的制备工艺、机理及研究结果。分析了还原剂强弱、浓度、滴加速度、反应温度以及p H等因素对包覆过程的影响。提出目前所用还原剂的缺陷和解决措施。最后,对新型还原剂的发展前景进行展望。
The research progress of the preparation of silver-coated copper powder by electroless plating was summarized. The preparation technology, mechanism and research results of formaldehyde, glucose, hydrazine hydrate, ascorbic acid and mixed reducing agent were introduced. The effects of reducing agent factors such as reductive strength, concentration dropping rate, reaction temperature and pH on the coating process were analyzed. The defects of the applied reducing agent and the measures to solve were put forward, and the development of the new reducing agent was prospected.
出处
《热加工工艺》
CSCD
北大核心
2017年第14期31-35,39,共6页
Hot Working Technology
基金
国家科技型中小企业创新资金资助项目(14C26215303257)
昆明理工大学分析测试基金资助项目(20150124)
关键词
镀银铜粉
化学还原
复合型还原剂
影响因素
展望
silver plating copper powder
chemical reduction
mixed reducing agent
influencing factors
prospect
