低线膨胀系数环氧树脂的制备与性能研究

Study on Performance of Low Linear Thermal Expansion Coefficient Epoxy Resin and Its Preparation

为满足电子封装材料对于热形状稳定性的要求,以对苯二甲酸和丁香酚为原料制备了一种新型环氧树脂单体,并对该单体进行了核磁共振氢谱(1H-NMR)和红外光谱(IR)表征,结果表明,成功制备了目标化合物。随后以聚醚胺类固化剂D230对制备的树脂进行固化,并对固化物进行了热失重(TG)和线膨胀系数(TMA)分析。结果表明,固化后的环氧树脂在90℃以下几乎没有发生膨胀变形,即使在105℃,其线膨胀系数也仅为5%左右,表现出良好的形状稳定性。

In order to meet the requirements of electronic packaging materials for thermal shape stability, a novel epoxy resin monomer was synthesized with the terephthalic acid and eugenol as raw materials. The target monomer was characterized by 1H-NMR and IR. The results demonstrate that the target compound is successfully prepared. Moreover, the monomer was cured by the polyether amine（D230）, and the cured product was characterized by means of TGA and TMA. The TMA test results indicate that the linear thermal expansion coefficient of the cured epoxy resin almost shows no change under 90℃, and its thermal expansion coefficient is only about 5% at 105℃, which indicating good shape stability of the synthesized epoxy resin.