高强度单组分环氧导电银胶的制备

Preparation of one component epoxy conductive silver adhesive with high strength

以E51环氧树脂作基料,甲基六氢苯酐(MHHPA)作固化剂,三级胺加合物作促进剂,按m_(E-51):m_(MHHPA):m_(三级胺加合物)=45:38:2配料,再配入5%(占配方总质量百分比)的稀释剂丙二醇甲醚醋酸酯及78%(占配方总质量百分比),粒径为2~4μm的片状银粉,制备出单组分环氧导电银胶。该导电胶可在150℃条件下,30 min快速固化,固化后体积电阻率为1.1×10^(-6)Ω·m,剪切强度可达14 MPa,常温25℃条件下贮存40 d未凝胶,且无明显析出或分层。

The one component epoxy conductive silver adhesive was prepared by using the E51 epoxy resin as the base material, methyl hexahydrophthalic anhydride （MHHPA） as the curing agent, the tertiary amine adduct as the accelerator, [re（E-51） ： m（MHFtPA） ： re（secondary amine） = 45 ： 38 ： 2], and adding 5% （by total mass of formulation） of the diluent propylene glycol methyl ether acetate and 79% （by total mass of formulation） of flake silver with particle size of 2 - 4 μ m. The results show that the adhesive can cure at 150℃ for 30 rain; after curing the volume resistivity is 1.1×10^-6Ω·m and the shear strength is up to 14 MPa. Moreover, the adhesive has no gel forming and no obvious precipitation or layering after storage at 25 ℃ for 40 days.