低热膨胀聚酰亚胺薄膜的研究进展与展望

Research Status and Prospects of Polyimide Films with Low Thermal Expansion Coefficient

聚酰亚胺是一种很有发展前途的高分子材料,热膨胀系数高的问题限制了聚酰亚胺的应用,降低热膨胀系数已成为聚酰亚胺研究热点之一。本文概述了国内外关于降低聚酰亚胺薄膜热膨胀系数的主要方法:分子结构设计法、共聚法、树脂共混法、添加纳米粒子法。阐述了工艺因素(如涂膜方式、牵伸条件等)对聚酰亚胺热膨胀系数的影响,并对未来低热膨胀系数聚酰亚胺薄膜的发展方向进行了展望。

Polyimide is one kind of polymer material with a great potential of development. With high thermal expansion coefficient, the application of polyimide is limited, so reducing the thermal expansion coefficient of polyimide has become one of the research hotspots. The main preparation methods of polyimide films with low thermal expansion coefficient were reviewed. These methods include molecule structure design of monomer, copolymerization, blending method and adding nanopartieles. The effects of process conditions（such as casting methods, drawing conditions and so on） on thermal expansion coefficient were presented. Finally the future development trend of polyimide films with low thermal expansion coefficient was prospected.