摘要
文章主要介绍印制电路板中的不同阻抗模块及应用,分析了不同线宽及介质层厚度对阻抗的影响度。并对材料D_k值进行研究,通过阻抗测量及切片数据分析,反推材料D_k值,验证出实际印制线路板中材料D_k值与材料供应商提供D_k值差异,以及印制电路板中,差分阻抗线与特性阻抗线周围D_k值差异。
This paper mainly introduced different impedance module and its application in printed circuit board, and analyzed the line width and thickness of dielectric layer which has an influence on the impedance. Through the research on the material Dk value, and the impedance measurement and slice data analysis, it is to obtain material Dk value and verify the difference between the actual PCB material Dk value and material suppliers Dk value, as well as the Dk difference around differential impedance line and characteristic impedance line.
作者
乐禄安
杜明星
莫崇明
LE Lu-an DU Ming-xing MO Chong-ming
出处
《印制电路信息》
2017年第8期10-15,25,共7页
Printed Circuit Information
关键词
阻抗
材料Dk
差分阻抗
特性阻抗
Impedance
Material Dk
Differential Impedance
Characteristic Impedance