摘要
随着天线系统的快速发展,无源互调性能在最近的3年开始出现于各大天线厂商的产品性能要求中,是现今通信网络最重要的指标要求之一。本文从微带天线在印制电路板层面的设计出发,通过线长、线宽、线厚三个传输线加工设计关键因素来分别对无源互调性能进行分析,为后续更好的天线系统互调性能设计提供参考。
With the development of the antenna system, the Passive Inter-Modulation became the required performance of the antenna products in recent 3 years. It's one of the most important factors of communication networks now. This paper is based on micro strip antenna's design in the manufacturing process of printed circuit board and analyzes the Passive Inter-Modulation from the key design factors, including line length, width and thickness, which provides a reference for the better Passive Inter-Modulation performance of antenna system's design.
作者
朱泳名
葛鹰
栾翼
ZHU Yong-ming GE Ying LUAN Yi
出处
《印制电路信息》
2017年第8期26-29,共4页
Printed Circuit Information
关键词
无源互调
微带天线
印制电路板
Passive Inter-Modulation
Microstrip Antenna
Printed Circuit Board