谈十层任意互连半孔选化HDI板制作难点及解决方法

Talking manufacture difficulties and solutions about 10L any interconnection HDI board with semi-hole and sorting plated

文章主要介绍一种十层任意互连细线路半孔选化板的制作,结合现有设备针对制程难点进行分析,给出初步解决方案并验证总结。此类板生产流程长,品质较难管控,不断优化制前设计及生产流程,提升品质良率。

This paper mainly introduces the fabrication of a ten layer of arbitrary interconnection fine line half hole Xuanhua plate, combined with existing equipment to analyze the process difficulty＇, with initial solution and verification summary. This kind of board production process is long, the quality is more difficult to control and continues to optimize the design and production process and improve the quality yield .