摘要
基于硅基有源驱动芯片和单色LED显示阵列芯片,利用光刻及沉膜工艺,在芯片上完成了640×480铟柱阵列的制备,之后采用回流焊、倒装焊工艺,实现了驱动芯片和显示芯片的互联。结果表明:采用倒装焊工艺可以实现硅基LED微显示器件的制作,具有可行性。
A 640×480 indium pillar array in the chip was fabricated by using photolithography and coating process.The interconnection between the silicon-based active drive chip and monochrome LED chip was achieved with reflow soldering and flip-chip technology.The proposed silicon-based active drive chip and LED display chip show advanced properties.
出处
《光电子技术》
CAS
2017年第2期119-123,135,共6页
Optoelectronic Technology
