大面阵红外探测器与低温冷平台集成后的应变测试研究

Test Study of Strain after Integration of Large Scale Infrared Detector Chip into Cryogenic Cold Platformat at Low Temperature

大面阵红外探测器是红外遥感仪器的核心元件。该类探测器大多由小规模面阵探测器拼接组成,与杜瓦低温冷平台集成后形成杜瓦组件。探测器在杜瓦低温冷平台上安装集成后的应力状态是影响芯片性能和寿命的关键因素。测试了低温时探测器在自由状态下和被安装在杜瓦组件内应变片的热输出,再利用两者的差值表征了探测器与杜瓦低温冷平台集成后的额外应变。以2000×512探测器组件为例,进行了测试验证分析,结果表明该方法可行。

Large area array infrared detectors are the core components in infrared remote sensing in-struments. Most of them are composed of spliced small-scale area array detectors and are integrated onDewar cold platforms to form Dewar assemblies. The stress state of a detector after being integrated onthe Dewar cold platform is a key factor affecting the performance and lifetime of the chip. The thermaloutput of a strain gage when the detector is both in the free state and in the Dewar is tested at low tem-perature. The difference between the two values is used to characterize the extra strain after the detectoris integrated with the Dewar cold platform. Taking a 2000x512 detector assembly as an example, thetest verification and analysis are carried out. The result shows that this method is feasible.